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  1. Pitt, Keith E. G. [Author] ; Pitt, Keith [Other]

    Handbook of thick film technology - [2. ed.]

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    Port Erin, Isle of Man, UK: Electrochemical Publ., 2005

  2. Haskard, Malcolm R. [Author]; Haskard, Malcolm [Author]; Pitt, Keith [Author] ; Pitt, Keith E. G. [Other]

    Thick-film technology and applications

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    Port Erin, Isle of Man, UK: Electrochemical Publ., 1997

  4. Miller, Lewis F. [Author]

    Thick film technology and chip joining

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    New York [u.a.]: Gordon and Breach, 1972

    Published in: Processes and materials in electronics ; 1

  6. Körner, Stefan [Author] ; Michaelis, Alexander [Other]; Rademann, Klaus [Other]

    Lösungs- und Ausscheidungsprozesse in silberhaltigen Glasschmelzen bei der thermischen Kontaktierung von multikristallinem Silicium

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    Dresden: Saechsische Landesbibliothek- Staats- und Universitaetsbibliothek Dresden, 2018

  7. DKE Deutsche Kommission Elektrotechnik Elektronik Informationstechnik in DIN und VDE, German Commission for Electrical, Electronic and Information Technologies of DIN and VDE, DIN Deutsches Institut für Normung e. V., DIN German Institute for Standardization

    DIN EN 165000-5 : Integrierte Hybrid- und Schichtschaltungen - Teil 5: Verfahren für die Bauartanerkennung; Deutsche Fassung EN 165000-5:1997 - [1998-09-00]

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    Berlin, Wien, Zürich: Beuth Verlag, 1998

    Published in: DIN-Regelwerk- Deutsche Normen