Media type: Book Title: Thick film technology and chip joining Contributor: Miller, Lewis F. [Author] imprint: New York [u.a.]: Gordon and Breach, 1972 Published in: Processes and materials in electronics ; 1 Extent: 221 S; graph. Darst Language: English ISBN: 0677034407 RVK notation: UP 7500 : Allgemeines Origination: Footnote:
Departmental Library DrePunct – stack Shelf-mark: 0970 18574 001 Item ID: 32521266 Status: Loanable, place order > Ordering possible ‒ please log in Delivery expected: 1 - 2 days after order