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  1. Lau, John H. [Editor]

    Ball grid array technology

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    New York [u.a.]: McGraw-Hill, Inc., 1995

    Published in: Electronic packaging and interconnection series

  6. Schempp, Fabian [Author] ; Wilde, Jürgen [Degree supervisor]; Wilde, Jürgen [Other]; Zimmermann, André [Other] Albert-Ludwigs-Universität Freiburg Institut für Mikrosystemtechnik, Albert-Ludwigs-Universität Freiburg Fakultät für Angewandte Wissenschaften

    Lötstellenzuverlässigkeit von Ball-Grid-Array-Bauelementen auf Leiterplatten mit mechanischen Zwangsbedingungen

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    Freiburg: Universität, 2022

  7. Gottfried Wilhelm Leibniz Universität Hannover Institut für Hochfrequenztechnik und Funksysteme, Hahn-Schickard-Gesellschaft für Angewandte Forschung

    Integration von zukünftigen Millimeterwellenfunksystemen unter Verwendung der LDS-MID-Technologie (LDS-HF-Systeme) : Schlussbericht vom 31.05.2022 zu IGF-Vorhaben Nr. 20668 N : Berichtszeitraum: 01.06.2019-30.11.2021

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    [Stuttgart]: [Hahn-Schickard], 31.05.2022

  11. Institute of Electrical and Electronics Engineers, Components, Packaging, and Manufacturing Technology Society

    13th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2012 : May 30, 2012 - June 1, 2012, San Diego, California, USA

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    Piscataway, NJ: IEEE, 2012

  12. Kromann, Gary B. [Other]; Culham, J. Richard [Other]; Ramakrishna, Koneru [Other] ; InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (7th :2000 :Las Vegas, Nev.), Components, Packaging & Manufacturing Technology Society

    ITherm 2000 : the Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, presented at Las Vegas, Nevada, USA, May 23-26, 2000

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    Piscataway, N.J: IEEE, 2011 ; [S.l.]: HathiTrust Digital Library

  15. Institute of Electrical and Electronics Engineers, Components, Packaging, and Manufacturing Technology Society

    The Tenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, 2006, ITHERM '06 : 30 May - 02 June 2006, [San Diego, CA]

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    Piscataway, NJ: IEEE Operations Center, 2006

  16. Ramakrishna, Koneru [Other] ; InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (9th :2004 :Las Vegas, Nev.), American Society of Mechanical Engineers, Components, Packaging & Manufacturing Technology Society

    ITherm 2004 : the Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems : Mirage Hotel & Casino, Las Vegas, NV, June 1-June 4, 2004

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    Piscataway, N.J: IEEE, 2004

  19. Buße, Dirk [Author] ; budatec GmbH

    "Entwicklung einer Integrationsplattform auf Waferebene für mikrooptische und mikromechanische Elektroniksysteme auf Basis funktioneller Glasgehäuse"; Akronym: PRISMA; Teilvorhaben: Entwicklung von Verfahren zur Metallisierung von leitenden Durchführungen in Glaswafern : Schlussbericht : zur Bekanntmachung Mikroelektronik aus Deutschland - Innovationstreiber der Digitalisierung 2016-2020 : Laufzeit des Vorhabens: 01.09.2017-31.08.2020 = "Development of a wafer-level integration platform for micro-optical and micromechanical electronic systems based on functional glass packages"; acronym: PRISMA; subproject: Development of processes for the metallisation of conductive feedthroughs in glass wafers TGV´s

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    [Berlin]: budatec GmbH, 06.06.2021

  20. Weinberger, Stefan [Author] ; X-FAB MEMS Foundry Itzehoe GmbH

    Plattform für Silizium-Glas-Verbund innerhalb des Verbundprojektes: Integrationsplattform für mikromechanische und -optische Elektroniksysteme auf Basis funktioneller Glasgehäuse - PRISMA : Abschlussbericht Oktober 2017 bis September 2020

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    Itzehoe: XFAB MEMS Foundry Itzehoe GmbH, [2020?]