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  1. Knechtel, Johann; Markov, Igor L.; Lienig, Jens

    Assembling 2-D Blocks Into 3-D Chips

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    Institute of Electrical and Electronics Engineers (IEEE), 2012

    Published in: IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems

  2. Knechtel, Johann; Young, Evangeline F. Y.; Lienig, Jens

    Planning Massive Interconnects in 3-D Chips

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    Institute of Electrical and Electronics Engineers (IEEE), 2015

    Published in: IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems

  3. Lehmkau, Robin; Mutschall, Doris; Kaiser, Alena; Ebermann, Martin; Neumann, Nobert; Czernohorsky, Malte; Neuber, Markus; Hiller, Karla; Seiler, Jan; Großmann, Toni D.; Shaporin, Alexey; Lienig, Jens

    Design and characterization of a pyroelectric detector based on three-dimensional structured hafnium oxide thin films

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    SPIE-Intl Soc Optical Eng, 2022

    Published in: Optical Engineering