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  1. Yi-Zhang, Tong [Author]; Kim, Jang-Kyo [Author] ; Zhang, Tong-Yi [Other] Hong Kong University of Science and Technology Department of Mechanical Engineering, MM 2003 Hongkong

    Macro-, meso-, micro- and nano-mechanics of materials : special issue containing the proceedings of the International Symposium on Macro-, Meso-, Micro- and Nano-Mechanics of Materials (MM2003), 8 - 10 December 2003, Hong Kong

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    Uetikon-Zürich [u.a.]: Trans Tech Publ., 2005

    Published in: Advanced materials research ; 900

  2. Hong Kong University of Science and Technology Center for Economic Policy

    HKUST CEP working paper

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    Hong Kong: HKUST Center for Economic Policy, October 2019- / No. 2019, 01-

  3. Zhang, Wei [Organizer]; Mao, Fubing [Editor] ; International Conference on Field-Programmable Technology 21. 2022 Hongkong; Online, Hong Kong University of Science and Technology

    FPT 2022 : 21st International Conference on Field-Programmable Technology$dproceedings : date: 5-9th Dec. 2022/place: Hong Kong University of Science and Technology, Hong Kong SAR

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    [Piscataway, NJ]: IEEE, 2022

  4. IEEE Hong Kong Electron Devices Meeting (1st :1994 :Hong Kong University of Science and Technology), Hong Kong University of Science and Technology, IEEE Electron Devices Society

    1994 IEEE Hong Kong Electron Devices Meeting : proceedings, July 18, 1994, the Hong Kong University of Science & Technology

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    [New York]; Piscataway, N.J: Institute of Electrical and Electronics Engineers, 1994

  5. Zhang, Fumin [Editor]; Zhang, Lichuan [Editor] ; International Conference on Automation, Control and Robotics Engineering 8. 2023 Hongkong, Hong Kong University of Science and Technology

    2023 8th International Conference on Automation, Control and Robotics Engineering : CACRE 2023$dJuly 13-15, 2023, Hong Kong, China

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    Piscataway, NJ: IEEE, 2023

  6. Hong Kong University of Science and Technology Institute for Emerging Market Studies

    HKUST IEMS working paper

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    Hong Kong: HKUST Institute for Emerging Market Studies, January 2015- / No. 2015, 01-

  7. IEEE Hong Kong Electron Devices Meeting (1998 :Hong Kong, China), Hong Kong University of Science and Technology Department of Electrical and Electronic Engineering, IEEE Electron Devices Society

    Proceedings : 1998 IEEE Hong Kong Electron Devices Meeting : 29 August, 1998, Hong Kong University of Science and Technology

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    Piscataway, N.J: Institute of Electrical and Electronics Engineers, 1998

  8. Chen, Kevin J. [Organizer]; Huang, Chih-Fang [Editor]; Yang, Shu [Editor] ; IEEE International Symposium on Power Semiconductor Devices and ICs 35. 2023 Hongkong, Hong Kong University of Science and Technology, Hong Kong University of Science and Technology, Institute of Electrical and Electronics Engineers, Institute of Electrical and Electronics Engineers

    The 35th International Symposium on Power Semiconductor Devices and ICs : 28 May-1 June, 2023, Hong Kong, China

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    [Piscataway, NJ]: IEEE, 2023

  9. Kwok, Hoi S. [Other]; Wong, Man [Other] ; Asian Symposium on Information Display (4th :1997 :Hong Kong University of Science and Technology), Hong Kong University of Science and Technology, Institute of Electrical and Electronics Engineers Hong Kong Section

    Proceedings of the Fourth Asian Symposium on Information Display : February 13-14, 1997, the Hong Kong University of Science and Technology

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    Hong Kong: Hong Kong University of Science and Technology, 1997

  10. International Conference on Electronic Materials and Packaging 20. 2018 Hongkong, Institute of Electrical and Electronics Engineers, Institute of Electrical and Electronics Engineers, IEEE Electronics Packaging Society, Hong Kong University of Science and Technology

    2018 20th International Conference on Electronic Materials and Packaging (EMAP)

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    [Piscataway, NJ]: IEEE, 2018

  11. International Symposium on Electronic Materials and Packaging (2000 :Hong Kong, China), Components, Packaging & Manufacturing Technology Society Hong Kong Chapter, EPACK LAB, Hong Kong University of Science and Technology Department of Mechanical Engineering, Institute of Electrical and Electronics Engineers

    International Symposium on Electronic Materials and Packaging : (EMAP2000) : November 30-December 2, 2000, Hong Kong

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    Piscataway, N.J: IEEE, 2010 ; [S.l.]: HathiTrust Digital Library

  12. IEEE International Conference on Field-Programmable Technology (1st :2002 :Chinese University of Hong Kong), Chinese University of Hong Kong Department of Computer Science and Engineering, Institute of Electrical and Electronics Engineers Hong Kong Section Computer Chapter

    2002 IEEE International Conference on Field-Programmable Technology (FPT) : proceedings : 16-18 December, 2002, the Chinese University of Hong Kong

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    Piscataway, N.J: Institute of Electrical & Electronics Engineers, 2002

  13. Cheung, William [Other] ; International Conference on E-Technology, E-Commerce and E-Service 2 2005 Hongkong, Hong Kong Baptist University Centre for E-Transformation Research, IEEE Computer Society Technical Committee on Electronic Commerce

    Proceedings / The 2005 IEEE International Conference on e-Technology, e-Commerce and e-Service, 2005, EEE '05 : [Lam Woo International Conference Centre, Hong Kong Baptist University, Hong Kong, China, March 29 - April 1, 2005]

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    Los Alamitos, Calif. [u.a.]: IEEE Computer Society, 2005