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International Conference on Electronic Materials and Packaging 20. 2018 Hongkong, Institute of Electrical and Electronics Engineers, Institute of Electrical and Electronics Engineers, IEEE Electronics Packaging Society, Hong Kong University of Science and Technology

2018 20th International Conference on Electronic Materials and Packaging (EMAP)

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  • Media type: E-Book; Conference Proceedings
  • Title: 2018 20th International Conference on Electronic Materials and Packaging (EMAP)
  • Corporation: Institute of Electrical and Electronics Engineers ; IEEE Electronics Packaging Society ; Hong Kong University of Science and Technology
  • Published: [Piscataway, NJ]: IEEE, 2018
  • Extent: 1 Online-Ressource; Illustrationen
  • Language: English
  • ISBN: 9781538656426
  • Keywords: Konferenzschrift
  • Origination:
  • Footnote: "Date of conference: 17-20 Dec. 2018" - IEEE Xplore
    "Conference location: Clear Water Bay, Hong Kong" - IEEE Xplore
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