Skip to contents Oelgeschläger, Detlef [Other]; Landesberger, Christof [Editor] ; Forschungszentrum Karlsruhe Innovative Fertigungsverfahren für neue Produkte auf der Basis dünner Silizium-Bauelemente : Ergebnisbericht des BMBF Verbundprojektes "InnoSi" Books Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. Stuttgart: Fraunhofer-IRB-Verl., 2004 Yacoub-George, Erwin [Author]; Hell, Waltraud [Author]; Oguz, Canbey [Author]; König, Martin [Author]; Landesberger, Christof [Author] ; Fraunhofer-Einrichtung für Mikrosysteme und Festkörper-Technologien EMFT Ultraschallsensoren für intelligente medizinische Pflaster (ULIMPIA); Teilvorhabensbezeichnung: Sensor- und Elektronikintegration auf Foliensubstraten für körpernahe Sensoren : Schlussbericht (Sachbericht) : Laufzeit des Vorhabens: 01.06.2018 bis 31.05.2021 Books View online Schließen > Access ... to E-book via DOI (Volltext ; freely accessible) Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. München: Fraunhofer EMFT, November 2021 Landesberger, Christof; Paschke, Christoph; Bock, Karlheinz Influence of Wafer Grinding and Etching Techniques on the Fracture Strength of Thin Silicon Substrates Articles View online Schließen > Access Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. Trans Tech Publications, Ltd., 2011 Published in: Advanced Materials Research, 325 (2011), Seite 659-665 Dieter Bollmann, Dieter Bollmann; Christof Landesberger, Christof Landesberger; Peter Ramm, Peter Ramm; Karl Haberger, Karl Haberger Analysis of Wafer Bonding by Infrared Transmission Articles View online Schließen > Access Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. IOP Publishing, 1996 Published in: Japanese Journal of Applied Physics, 35 (1996) 7R, Seite 3807 Hiroshima, Mitsuru; Arita, Kiyoshi; Haji, Hiroshi; Landesberger, Christof; Bock, Karlheinz A Robustness Study on Self-Alignment of Thin-Si Dies Using Surface Tension Articles View online Schließen > Access Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. Japan Institute of Electronics Packaging, 2013 Published in: Journal of The Japan Institute of Electronics Packaging, 16 (2013) 3, Seite 227-230 Schoenfelder, Stephan; Ebert, Matthias; Landesberger, Christof; Bock, Karlheinz; Bagdahn, Jörg Investigations of the influence of dicing techniques on the strength properties of thin silicon Articles View online Schließen > Access Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. Elsevier BV, 2007 Published in: Microelectronics Reliability, 47 (2007) 2-3, Seite 168-178 Palavesam, Nagarajan; Hell, Waltraud; Drost, Andreas; Landesberger, Christof; Kutter, Christoph; Bock, Karlheinz Influence of Flexibility of the Interconnects on the Dynamic Bending Reliability of Flexible Hybrid Electronics Articles View online Schließen > Access Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. MDPI AG, 2020 Published in: Electronics, 9 (2020) 2, Seite 238 Palavesam, Nagarajan; Marin, Sonia; Hemmetzberger, Dieter; Landesberger, Christof; Bock, Karlheinz; Kutter, Christoph Roll-to-roll processing of film substrates for hybrid integrated flexible electronics Articles View online Schließen > Access Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. IOP Publishing, 2018 Published in: Flexible and Printed Electronics, 3 (2018) 1, Seite 014002 Velten, Thomas; Bauerfeld, Frank; Schuck, Herbert; Scherbaum, Sabine; Landesberger, Christof; Bock, Karlheinz Roll-to-roll hot embossing of microstructures Articles View online Schließen > Access Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. Springer Science and Business Media LLC, 2011 Published in: Microsystem Technologies, 17 (2011) 4, Seite 619-627 Alberti, Martin; Yacoub-George, Erwin; Hell, Waltraud; Landesberger, Christof; Bock, Karlheinz Biomolecular self-assembly of micrometer sized silica beads on patterned glass substrates Articles View online Schließen > Access Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. Elsevier BV, 2009 Published in: Applied Surface Science, 255 (2009) 17, Seite 7759-7765 El Hasni, Akram; Pfirrmann, Stefan; Kolander, Anett; Yacoub-George, Erwin; König, Martin; Landesberger, Christof; Voigt, Anja; Grützner, Gabi; Schnakenberg, Uwe Six-layer lamination of a new dry film negative-tone photoresist for fabricating complex 3D microfluidic devices Articles View online Schließen > Access Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. Springer Science and Business Media LLC, 2017 Published in: Microfluidics and Nanofluidics, 21 (2017) 3
Oelgeschläger, Detlef [Other]; Landesberger, Christof [Editor] ; Forschungszentrum Karlsruhe Innovative Fertigungsverfahren für neue Produkte auf der Basis dünner Silizium-Bauelemente : Ergebnisbericht des BMBF Verbundprojektes "InnoSi" Books Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. Stuttgart: Fraunhofer-IRB-Verl., 2004
Yacoub-George, Erwin [Author]; Hell, Waltraud [Author]; Oguz, Canbey [Author]; König, Martin [Author]; Landesberger, Christof [Author] ; Fraunhofer-Einrichtung für Mikrosysteme und Festkörper-Technologien EMFT Ultraschallsensoren für intelligente medizinische Pflaster (ULIMPIA); Teilvorhabensbezeichnung: Sensor- und Elektronikintegration auf Foliensubstraten für körpernahe Sensoren : Schlussbericht (Sachbericht) : Laufzeit des Vorhabens: 01.06.2018 bis 31.05.2021 Books View online Schließen > Access ... to E-book via DOI (Volltext ; freely accessible) Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. München: Fraunhofer EMFT, November 2021
Landesberger, Christof; Paschke, Christoph; Bock, Karlheinz Influence of Wafer Grinding and Etching Techniques on the Fracture Strength of Thin Silicon Substrates Articles View online Schließen > Access Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. Trans Tech Publications, Ltd., 2011 Published in: Advanced Materials Research, 325 (2011), Seite 659-665
Dieter Bollmann, Dieter Bollmann; Christof Landesberger, Christof Landesberger; Peter Ramm, Peter Ramm; Karl Haberger, Karl Haberger Analysis of Wafer Bonding by Infrared Transmission Articles View online Schließen > Access Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. IOP Publishing, 1996 Published in: Japanese Journal of Applied Physics, 35 (1996) 7R, Seite 3807
Hiroshima, Mitsuru; Arita, Kiyoshi; Haji, Hiroshi; Landesberger, Christof; Bock, Karlheinz A Robustness Study on Self-Alignment of Thin-Si Dies Using Surface Tension Articles View online Schließen > Access Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. Japan Institute of Electronics Packaging, 2013 Published in: Journal of The Japan Institute of Electronics Packaging, 16 (2013) 3, Seite 227-230
Schoenfelder, Stephan; Ebert, Matthias; Landesberger, Christof; Bock, Karlheinz; Bagdahn, Jörg Investigations of the influence of dicing techniques on the strength properties of thin silicon Articles View online Schließen > Access Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. Elsevier BV, 2007 Published in: Microelectronics Reliability, 47 (2007) 2-3, Seite 168-178
Palavesam, Nagarajan; Hell, Waltraud; Drost, Andreas; Landesberger, Christof; Kutter, Christoph; Bock, Karlheinz Influence of Flexibility of the Interconnects on the Dynamic Bending Reliability of Flexible Hybrid Electronics Articles View online Schließen > Access Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. MDPI AG, 2020 Published in: Electronics, 9 (2020) 2, Seite 238
Palavesam, Nagarajan; Marin, Sonia; Hemmetzberger, Dieter; Landesberger, Christof; Bock, Karlheinz; Kutter, Christoph Roll-to-roll processing of film substrates for hybrid integrated flexible electronics Articles View online Schließen > Access Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. IOP Publishing, 2018 Published in: Flexible and Printed Electronics, 3 (2018) 1, Seite 014002
Velten, Thomas; Bauerfeld, Frank; Schuck, Herbert; Scherbaum, Sabine; Landesberger, Christof; Bock, Karlheinz Roll-to-roll hot embossing of microstructures Articles View online Schließen > Access Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. Springer Science and Business Media LLC, 2011 Published in: Microsystem Technologies, 17 (2011) 4, Seite 619-627
Alberti, Martin; Yacoub-George, Erwin; Hell, Waltraud; Landesberger, Christof; Bock, Karlheinz Biomolecular self-assembly of micrometer sized silica beads on patterned glass substrates Articles View online Schließen > Access Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. Elsevier BV, 2009 Published in: Applied Surface Science, 255 (2009) 17, Seite 7759-7765
El Hasni, Akram; Pfirrmann, Stefan; Kolander, Anett; Yacoub-George, Erwin; König, Martin; Landesberger, Christof; Voigt, Anja; Grützner, Gabi; Schnakenberg, Uwe Six-layer lamination of a new dry film negative-tone photoresist for fabricating complex 3D microfluidic devices Articles View online Schließen > Access Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. Springer Science and Business Media LLC, 2017 Published in: Microfluidics and Nanofluidics, 21 (2017) 3
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