Skip to contents Bakir, Muhannad S. [Editor]; Sitaraman, Suresh K. [Editor] Flexible chip I/O interconnects Books Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. Singapore; Hackensack (New Jersey); London: World Scientific Publishing Co. Pte. Ltd., [2020] Published in: Encyclopedia of packaging materials, processes, and mechanics ; 1,3 Perkins, Andrew E. [Author]; Sitaraman, Suresh K. [Author] Solder joint reliability prediction for multiple environments Books Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. New York, NY: Springer, 2009 Chen, Wei; Sitaraman, Suresh K. Area-Array of 3-Arc-Fan Compliant Interconnects as Effective Drop-Impact Isolator for Microsystems Articles View online Schließen > Access Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. Institute of Electrical and Electronics Engineers (IEEE), 2016 Published in: Journal of Microelectromechanical Systems Chen, Wei; Sitaraman, Suresh K. Response Surface and Multiobjective Optimization Methodology for the Design of Compliant Interconnects Articles View online Schließen > Access Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. Institute of Electrical and Electronics Engineers (IEEE), 2014 Published in: IEEE Transactions on Components, Packaging and Manufacturing Technology Tunga, Krishna; Sitaraman, Suresh K. Laser moiré interferometry for fatigue life prediction of lead-free solders Articles View online Schließen > Access Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. Elsevier BV, 2010 Published in: Microelectronics Reliability Kacker, Karan; Sitaraman, Suresh K. Reliability Assessment and Failure Analysis of G-Helix, a Free-Standing Compliant Off-Chip Interconnect Articles View online Schließen > Access Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. IMAPS - International Microelectronics Assembly and Packaging Society, 2009 Published in: Journal of Microelectronics and Electronic Packaging Perkins, Andy; Sitaraman, Suresh K. Analysis and Prediction of Vibration-Induced Solder Joint Failure for a Ceramic Column Grid Array Package Articles View online Schließen > Access Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. ASME International, 2008 Published in: Journal of Electronic Packaging Kacker, Karan; Sitaraman, Suresh K. Design and Fabrication of FlexConnects: A Cost-Effective Implementation of Compliant Chip-to-Substrate Interconnects Articles View online Schließen > Access Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. Institute of Electrical and Electronics Engineers (IEEE), 2008 Published in: IEEE Transactions on Components and Packaging Technologies Tunga, Krishna; Sitaraman, Suresh K. An Expedient Experimental Technique for the Determination of Thermal Cycling Fatigue Life for BGA Package Solder Balls Articles View online Schließen > Access Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. ASME International, 2007 Published in: Journal of Electronic Packaging Zheng, Jiantao; Sitaraman, Suresh K. Fixtureless superlayer-driven delamination test for nanoscale thin-film interfaces Articles View online Schließen > Access Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. Elsevier BV, 2007 Published in: Thin Solid Films Perkins, Andy; Sitaraman, Suresh K. Universal fatigue life prediction equation for ceramic ball grid array (CBGA) packages Articles View online Schließen > Access Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. Elsevier BV, 2007 Published in: Microelectronics Reliability Modi, Mitul; Sitaraman, Suresh K. Interfacial Fracture Toughness Measurement of a Ti/Si Interface Articles View online Schließen > Access Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. ASME International, 2004 Published in: Journal of Electronic Packaging Ahmad, Mudasir; Sitaraman, Suresh K. Study of Mechanical Behavior of Compliant Micro-Springs for Next Generation Probing Applications Articles View online Schließen > Access Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. ASME International, 2002 Published in: Journal of Electronic Packaging Xie, Weidong; Sitaraman, Suresh K. Interfacial Thermal Stress Analysis of Anisotropic Multi-Layered Electronic Packaging Structures Articles View online Schließen > Access Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. ASME International, 2000 Published in: Journal of Electronic Packaging Chow, Justin H.; Sitaraman, Suresh K. The Resistor Network Approach to Modeling Screen-Printed Silver Ink Under Uniaxial Stretch Articles View online Schließen > Access Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. ASME International, 2023 Published in: Journal of Electronic Packaging Ye, Chong; Chen, Rui; Sitaraman, Suresh K An automatic numerical approach to optimize flexible serpentine structure design Articles View online Schließen > Access Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. IOP Publishing, 2022 Published in: Flexible and Printed Electronics Ginga, Nicholas J.; Sitaraman, Suresh K. Thermomechanical Reliability Investigation of Carbon Nanotube Off-Chip Interconnects for Electronic Packages Articles View online Schließen > Access Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. Institute of Electrical and Electronics Engineers (IEEE), 2022 Published in: IEEE Transactions on Components, Packaging and Manufacturing Technology Stewart, Benjamin G.; Sitaraman, Suresh K. Biaxial Inflation Stretch Test for Flexible Electronics Articles View online Schließen > Access Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. Wiley, 2021 Published in: Advanced Engineering Materials Chen, Wei; Bhat, Anirudh; Sitaraman, Suresh K. Impact Isolation Through the Use of Compliant Interconnects for Microelectronic Packages Articles View online Schließen > Access Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. ASME International, 2015 Published in: Journal of Electronic Packaging Chen, Wei; Okereke, Raphael; Sitaraman, Suresh K. Compliance analysis of multi-path fan-shaped interconnects Articles View online Schließen > Access Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. Elsevier BV, 2013 Published in: Microelectronics Reliability
Bakir, Muhannad S. [Editor]; Sitaraman, Suresh K. [Editor] Flexible chip I/O interconnects Books Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. Singapore; Hackensack (New Jersey); London: World Scientific Publishing Co. Pte. Ltd., [2020] Published in: Encyclopedia of packaging materials, processes, and mechanics ; 1,3
Perkins, Andrew E. [Author]; Sitaraman, Suresh K. [Author] Solder joint reliability prediction for multiple environments Books Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. New York, NY: Springer, 2009
Chen, Wei; Sitaraman, Suresh K. Area-Array of 3-Arc-Fan Compliant Interconnects as Effective Drop-Impact Isolator for Microsystems Articles View online Schließen > Access Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. Institute of Electrical and Electronics Engineers (IEEE), 2016 Published in: Journal of Microelectromechanical Systems
Chen, Wei; Sitaraman, Suresh K. Response Surface and Multiobjective Optimization Methodology for the Design of Compliant Interconnects Articles View online Schließen > Access Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. Institute of Electrical and Electronics Engineers (IEEE), 2014 Published in: IEEE Transactions on Components, Packaging and Manufacturing Technology
Tunga, Krishna; Sitaraman, Suresh K. Laser moiré interferometry for fatigue life prediction of lead-free solders Articles View online Schließen > Access Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. Elsevier BV, 2010 Published in: Microelectronics Reliability
Kacker, Karan; Sitaraman, Suresh K. Reliability Assessment and Failure Analysis of G-Helix, a Free-Standing Compliant Off-Chip Interconnect Articles View online Schließen > Access Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. IMAPS - International Microelectronics Assembly and Packaging Society, 2009 Published in: Journal of Microelectronics and Electronic Packaging
Perkins, Andy; Sitaraman, Suresh K. Analysis and Prediction of Vibration-Induced Solder Joint Failure for a Ceramic Column Grid Array Package Articles View online Schließen > Access Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. ASME International, 2008 Published in: Journal of Electronic Packaging
Kacker, Karan; Sitaraman, Suresh K. Design and Fabrication of FlexConnects: A Cost-Effective Implementation of Compliant Chip-to-Substrate Interconnects Articles View online Schließen > Access Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. Institute of Electrical and Electronics Engineers (IEEE), 2008 Published in: IEEE Transactions on Components and Packaging Technologies
Tunga, Krishna; Sitaraman, Suresh K. An Expedient Experimental Technique for the Determination of Thermal Cycling Fatigue Life for BGA Package Solder Balls Articles View online Schließen > Access Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. ASME International, 2007 Published in: Journal of Electronic Packaging
Zheng, Jiantao; Sitaraman, Suresh K. Fixtureless superlayer-driven delamination test for nanoscale thin-film interfaces Articles View online Schließen > Access Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. Elsevier BV, 2007 Published in: Thin Solid Films
Perkins, Andy; Sitaraman, Suresh K. Universal fatigue life prediction equation for ceramic ball grid array (CBGA) packages Articles View online Schließen > Access Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. Elsevier BV, 2007 Published in: Microelectronics Reliability
Modi, Mitul; Sitaraman, Suresh K. Interfacial Fracture Toughness Measurement of a Ti/Si Interface Articles View online Schließen > Access Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. ASME International, 2004 Published in: Journal of Electronic Packaging
Ahmad, Mudasir; Sitaraman, Suresh K. Study of Mechanical Behavior of Compliant Micro-Springs for Next Generation Probing Applications Articles View online Schließen > Access Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. ASME International, 2002 Published in: Journal of Electronic Packaging
Xie, Weidong; Sitaraman, Suresh K. Interfacial Thermal Stress Analysis of Anisotropic Multi-Layered Electronic Packaging Structures Articles View online Schließen > Access Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. ASME International, 2000 Published in: Journal of Electronic Packaging
Chow, Justin H.; Sitaraman, Suresh K. The Resistor Network Approach to Modeling Screen-Printed Silver Ink Under Uniaxial Stretch Articles View online Schließen > Access Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. ASME International, 2023 Published in: Journal of Electronic Packaging
Ye, Chong; Chen, Rui; Sitaraman, Suresh K An automatic numerical approach to optimize flexible serpentine structure design Articles View online Schließen > Access Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. IOP Publishing, 2022 Published in: Flexible and Printed Electronics
Ginga, Nicholas J.; Sitaraman, Suresh K. Thermomechanical Reliability Investigation of Carbon Nanotube Off-Chip Interconnects for Electronic Packages Articles View online Schließen > Access Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. Institute of Electrical and Electronics Engineers (IEEE), 2022 Published in: IEEE Transactions on Components, Packaging and Manufacturing Technology
Stewart, Benjamin G.; Sitaraman, Suresh K. Biaxial Inflation Stretch Test for Flexible Electronics Articles View online Schließen > Access Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. Wiley, 2021 Published in: Advanced Engineering Materials
Chen, Wei; Bhat, Anirudh; Sitaraman, Suresh K. Impact Isolation Through the Use of Compliant Interconnects for Microelectronic Packages Articles View online Schließen > Access Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. ASME International, 2015 Published in: Journal of Electronic Packaging
Chen, Wei; Okereke, Raphael; Sitaraman, Suresh K. Compliance analysis of multi-path fan-shaped interconnects Articles View online Schließen > Access Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. Elsevier BV, 2013 Published in: Microelectronics Reliability
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