Media type: Book Title: Flexible chip I/O interconnects Contributor: Bakir, Muhannad S. [HerausgeberIn]; Sitaraman, Suresh K. [HerausgeberIn] imprint: Singapore; Hackensack (New Jersey); London: World Scientific Publishing Co. Pte. Ltd., [2020] Published in: Encyclopedia of packaging materials, processes, and mechanics ; 1,3 Extent: xii, 149 Seiten; Illustrationen, Diagramme Language: English ISBN: 9811201145; 9789811201141 RVK notation: ZN 4192 : Technologie diskreter Bauelemente (Bonden; Gehäuse); Packaging Origination: Footnote: Literaturangaben
Departmental Library DrePunct – open access area Shelf-mark: ZN 4192 Z63-1,3 Item ID: 34980759 Status: Loanable