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Toh, Kok Chuan [Other] ; Electronics Packaging Technology Conference 6 2004 Singapur, IEEE Reliability/CPMT/ED Singapore Chapter, Components, Packaging, and Manufacturing Technology Society, International Microelectronics and Packaging Society

Proceedings of 6th Electronics Packaging Technology Conference, 2004, EPTC 2004 : 8 - 10 Dec. 2004, [Pan Pacific Hotel, Singapore]

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Piscataway, NJ: IEEE Service Center, 2004
Toh, Kok Chuan [Other]; Iyer, Mahadevan K. [Other]; Mui, Yew Cheong [Other] ; Electronic Packaging Technology Conference (5th :2003 :Singapore), Components, Packaging & Manufacturing Technology Society, IEEE Reliability/CPMT/ED Singapore Chapter, International Microelectronics and Packaging Society

Proceedings of 5th Electronics Packaging Technology Conference : (EPTC 2003) : 10-12 December, 2003, Grand Pacific Hotel, Singapore

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Piscataway, NJ: IEEE, 2003
Lee, Charles [Other]; Toh, Kok Chuan [Other]; Lim, Thiam Beng [Other] ; Electronic Packaging Technology Conference (3rd :2000 :Singapore), Components, Packaging & Manufacturing Technology Society, IEEE Reliability/CPMT/ED Singapore Chapter, International Microelectronics and Packaging Society

Proceedings of 3rd Electronics Packaging Technology Conference : (EPTC 2000) : 5-7 December, 2000, Sheraton Towers, Singapore

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Piscataway, NJ: IEEE, 2000
Toh, Kim‐Chuan; Phoon, Kok‐Kwang

Comparison between iterative solution of symmetric and non‐symmetric forms of Biot's FEM equations using the generalized Jacobi preconditioner

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Wiley, 2008

Published in: International Journal for Numerical and Analytical Methods in Geomechanics, 32 (2008) 9, Seite 1131-1146
Tang, Chong; Phoon, Kok-Kwang; Toh, Kim-Chuan

Effect of footing width on Nγ and failure envelope of eccentrically and obliquely loaded strip footings on sand

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Canadian Science Publishing, 2015

Published in: Canadian Geotechnical Journal, 52 (2015) 6, Seite 694-707
Xia, Wenfeng; Wen, Yonggang; Toh, Kok-Chuan; Wong, Yew-Wah

Toward green data centers as an interruptible load for grid stabilization in Singapore

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Institute of Electrical and Electronics Engineers (IEEE), 2015

Published in: IEEE Communications Magazine, 53 (2015) 11, Seite 192-198
Tang, Chong; Toh, Kim-Chuan; Phoon, Kok-Kwang

Axisymmetric Lower-Bound Limit Analysis Using Finite Elements and Second-Order Cone Programming

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American Society of Civil Engineers (ASCE), 2014

Published in: Journal of Engineering Mechanics, 140 (2014) 2, Seite 268-278
Chaudhary, Krishna Bahadur; Phoon, Kok-Kwang; Toh, Kim-Chuan

Inexact Block Diagonal Preconditioners to Mitigate the Effects of Relative Differences in Material Stiffnesses

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American Society of Civil Engineers (ASCE), 2013

Published in: International Journal of Geomechanics, 13 (2013) 3, Seite 273-291
Chen, Xi; Phoon, Kok-Kwang; Toh, Kim-Chuan

Performance of Zero-Level Fill-In Preconditioning Techniques for Iterative Solutions with Geotechnical Applications

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American Society of Civil Engineers (ASCE), 2012

Published in: International Journal of Geomechanics, 12 (2012) 5, Seite 596-605
Toh, Kim‐Chuan; Phoon, Kok‐Kwang; Chan, Swee‐Huat

Block preconditioners for symmetric indefinite linear systems

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Wiley, 2004

Published in: International Journal for Numerical Methods in Engineering, 60 (2004) 8, Seite 1361-1381
Nguyen, Nam-Trung; Huang, Xiaoyang; Chuan, Toh Kok

MEMS-Micropumps: A Review

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ASME International, 2002

Published in: Journal of Fluids Engineering, 124 (2002) 2, Seite 384-392
Tio, Kek-Kiong; Liu, Chang Yu; Toh, Kok Chuan

Thermal analysis of micro heat pipes using a porous-medium model

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Springer Science and Business Media LLC, 2000

Published in: Heat and Mass Transfer, 36 (2000) 1, Seite 21-28
Zhang, Weiwen; Wen, Yonggang; Wah Wong, Yew; Chuan Toh, Kok; Chen, Chiu-Hao

Towards Joint Optimization Over ICT and Cooling Systems in Data Centre: A Survey

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Institute of Electrical and Electronics Engineers (IEEE), 2016

Published in: IEEE Communications Surveys & Tutorials, 18 (2016) 3, Seite 1596-1616
Tan, S. P.; Toh, Kok Chuan; Khan, Navas; Pinjala, D.; Kripesh, V.

Development of Single Phase Liquid Cooling Solution for 3-D Silicon Modules

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Institute of Electrical and Electronics Engineers (IEEE), 2011

Published in: IEEE Transactions on Components, Packaging and Manufacturing Technology, 1 (2011) 4, Seite 536-544
Phoon, Kok‐Kwang; Chan, Swee‐Huat; Toh, Kim‐Chuan; Lee, Fook‐Hou

Fast iterative solution of large undrained soil‐structure interaction problems

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Wiley, 2003

Published in: International Journal for Numerical and Analytical Methods in Geomechanics, 27 (2003) 3, Seite 159-181
Jiao, Yanmei; Li, Yuanlong; Wen, Yonggang; Wah Wong, Yew; Chuan Toh, Kok; Cheng Chua, Chee; Ang, Wilson

Thermal Analysis for Underground Data Centres in the Tropics

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Elsevier BV, 2017

Published in: Energy Procedia, 143 (2017), Seite 223-229
Aibin Yu; Khan, N.; Archit, G.; Pinjala, D.; Kok Chuan Toh; Kripesh, V.; Seung Wook Yoon; Lau, J.H.

Fabrication of Silicon Carriers With TSV Electrical Interconnections and Embedded Thermal Solutions for High Power 3-D Packages

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Institute of Electrical and Electronics Engineers (IEEE), 2009

Published in: IEEE Transactions on Components and Packaging Technologies, 32 (2009) 3, Seite 566-571
Khan, Navas; Yu, Li Hong; Pin, Tan Siow; Ho, Soon Wee; Kripesh, Vaidyanathan; Pinjala, Damaruganath; Lau, John H.; Chuan, Toh Kok

3-D Packaging With Through-Silicon Via (TSV) for Electrical and Fluidic Interconnections

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Institute of Electrical and Electronics Engineers (IEEE), 2013

Published in: IEEE Transactions on Components, Packaging and Manufacturing Technology, 3 (2013) 2, Seite 221-228
Loo, Benny Kai Guo; Sirisena, Dinesh; Müller-Riemenschneider, Falk; Chia, Michael Yong Hwa; Tan, Benedict; Tan, Ngiap Chuan; Teoh, Oon Hoe; Lim, Ethel Jie Kai; Zainuddin, Mohammad Ashik; Gao, Joanne Shumin; Chan, Poh Chong; Tan, Teresa Shu Zhen; Visruthan, Nirmal Kavalloor; Rajadurai, Victor Samuel; Chia, Moira Suyin; Ahmad Hatib, Nur Adila Binte; Cai, Shirong; Ong, Ju Lynn; Lo, June Chi Yan; Chong, Mary Foong-Fong; Lee, Le Ye; Chew, Elaine Chu Shan; Siriamornsarp, Ratnaporn; Lee, Miriam; [...]

Consensus statement on Singapore integrated 24-hour activity guide for early childhood

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Academy of Medicine, Singapore, 2023

Published in: Annals of the Academy of Medicine, Singapore, 52 (2023) 6, Seite 310-320
Loo, Benny Kai Guo; Sirisena, Dinesh; Müller-Riemenschneider, Falk; Chia, Michael Yong Hwa; Tan, Benedict; Tan, Ngiap Chuan; Teoh, Oon Hoe; Lim, Ethel Jie Kai; Zainuddin, Mohammad Ashik; Gao, Joanne Shumin; Chan, Poh Chong; Tan, Teresa Shu Zhen; Visruthan, Nirmal Kavalloor; Rajadurai, Victor Samuel; Chia, Moira Suyin; Ahmad Hatib, Nur Adila Binte; Cai, Shirong; Ong, Ju Lynn; Lo, June Chi Yan; Chong, Mary Foong-Fong; Lee, Le Ye; Chew, Elaine Chu Shan; Siriamornsarp, Ratnaporn; Lee, Miriam; [...]

Consensus statement on Singapore integrated 24-hour activity guide for early childhood

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Academy of Medicine, Singapore, 2023

Published in: Annals of the Academy of Medicine, Singapore, 52 (2023) 6, Seite 310-320

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