Media type: E-Article Title: Fabrication of Silicon Carriers With TSV Electrical Interconnections and Embedded Thermal Solutions for High Power 3-D Packages Contributor: Aibin Yu; Khan, N.; Archit, G.; Pinjala, D.; Kok Chuan Toh; Kripesh, V.; Seung Wook Yoon; Lau, J.H. Published: Institute of Electrical and Electronics Engineers (IEEE), 2009 Published in: IEEE Transactions on Components and Packaging Technologies, 32 (2009) 3, Seite 566-571 Language: Not determined DOI: 10.1109/tcapt.2009.2012719 ISSN: 1521-3331; 1557-9972 Keywords: Electrical and Electronic Engineering ; Electronic, Optical and Magnetic Materials Origination: Footnote: