Media type: Microfiche; Thesis Title: Microelectronic bonding process monitoring by integrated sensors Contributor: Mayer, Michael [Author] imprint: 2000 Mikrofiche-Ausg. Extent: II, 105 S.; Ill., graph. Darst Language: English RVK notation: ZN 4192 : Technologie diskreter Bauelemente (Bonden; Gehäuse); Packaging Keywords: Chip > CMOS > Bonden > Prozessüberwachung > Echtzeitsystem > Integrierter Sensor Type of reproduction: Mikrofiche-Ausg. Origination: University thesis: Zürich, Eidgenössische Techn. Hochsch., Diss. 2000 Footnote:
Central Library – stack Shelf-mark: 2002 8 067551 Item ID: 30905144 Notizen: 2 Mikrofiches Status: Place order for use in library, interlibrary loan possible > Ordering possible ‒ please log in Orders received from Mon - Fri by 1 pm are expected to be ready for you on the same day.