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Kim, Sung Jin [Author] ; Technische Universität Dresden

3D thin electronics packaging technologies for mobile and wearable applications

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  • Media type: Book; Thesis
  • Title: 3D thin electronics packaging technologies for mobile and wearable applications
  • Contributor: Kim, Sung Jin [VerfasserIn]
  • Corporation: Technische Universität Dresden
  • imprint: 2016
  • Extent: v, 109 Seiten
  • Language: English
  • RVK notation: ZN 4150 : Dünnschichttechnologie
  • Keywords: Hochschulschrift
  • Origination:
  • University thesis: Dissertation, Technische Universität Dresden, 2016
  • Footnote:

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Central Library – stack

  • Shelf-mark: 2016 8 029234
  • Item ID: 34122736
  • Status: Loanable, place order
Orders received from Mon - Fri by 1 pm are expected to be ready for you on the same day.

Departmental Library DrePunct – stack

  • Shelf-mark: 2016 8 029235
  • Item ID: 34122737
  • Status: Place order for use in library, no dispatch by interlibrary loan; delivery of photocopies possible
Delivery expected: 1 - 2 days after order