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Media type:
E-Book
Title:
Multi-Objective Optimization for Heat Transfer Performance of Micro-Fins and Signal Integrity of Key Interconnect Technologies in 3d Integrated Chips
Description:
This paper is devoted to the synergistic design of the thermal management and signal integrity for 3D integrated chips. The structure parameters of the micro-fin and interconnected components are optimized to obtain a balanced performance of chip heat dissipation and signal integrity. The three-dimensional integrated chip flows heat transfer model under the action of electrothermal coupling is developed. A full-wave electromagnetic simulation model of the signal interconnection components is also proposed with the same structural parameters. The effects of various structural factors on the heat transfer performance and signal integrity of 3D integrated chips are investigated. A genetic algorithm multi-objective optimization is carried out to simultaneously reduce the total thermal resistance of the 3D integrated chip and the signal transmission losses of the critical interconnect components. The results show that the total thermal resistance of the 3D IC becomes lower with larger TSV diameter, micro-fins height and micro-fine radius, and smaller oxide thickness. When the TSV diameter and oxide thickness increase, the height and radius of the micro fins are reduced to facilitate the signal transmission of the chip interconnected components. A multi-objective optimization approach significantly improves the chip's heat transfer performance and signal integrity. The chip designer can determine the optimal solution by deciding the weights of the two optimization objectives depending on the practical requirements