Media type: Book; Bibliography Title: Handbook of lead-free solder technology for microelectronic assemblies Contributor: Puttlitz, Karl J. [Hrsg.] imprint: New York, NY; Basel: Dekker, 2004 Published in: Mechanical engineering ; 17000 Extent: XI, 1026 S.; Ill., graph. Darst Language: English ISBN: 0824748700 Keywords: Oberflächenmontage > Lot > Umweltverträgliches Produkt > Elektronisches Bauelement > Mikroelektronik Origination: Footnote: Literaturangaben
Departmental Library DrePunct – open access area Shelf-mark: ZN 4125 P993 Item ID: 31133110 Status: Loanable