• Media type: Book
  • Title: Advanced materials for thermal management of electronic packaging
  • Contains: Thermal management fundamentals and design guides in electronic packaging -- Characterization methodologies of thermal management materials -- Electronic packaging materials and their functions in thermal managements -- Monolithic carbonaceous materials and carbon matrix composites -- Thermally conductive polymer matrix composites -- HIgh thermal conductivity metal matrix composites -- Thermally conductive ceramic matrix composites -- Thermal interface materials in electronic packaging -- Materials and design for advanced heat spreader and air cooling heat sinks -- Liquid cooling devices and their materials selection -- Thermoelectric cooling through thermoelectric materials -- Development and application of advanced thermal management materials -- Standards and specifications for evaluation of thermal management in electronic industry.
  • Contributor: Tong, Xingcun Colin [Author]
  • imprint: New York NY; Heidelberg [u.a.]: Springer, 2011
  • Published in: Advanced microelectronics ; 30
  • Extent: XXI, 616 S.; Ill., graph. Darst; 242 mm x 160 mm
  • Language: English
  • ISBN: 9781441977588
  • Publisher, production or purchase order numbers: Sonstige Nummer: 12831258
  • RVK notation: ZN 3400 : Allgemeines
  • Keywords: Werkstoff > Elektronisches Bauelement > Temperaturverhalten
  • Origination:
  • Footnote: Literaturangaben
  • Description: Thermal management fundamentals and design guides in electronic packaging -- Characterization methodologies of thermal management materials -- Electronic packaging materials and their functions in thermal managements -- Monolithic carbonaceous materials and carbon matrix composites -- Thermally conductive polymer matrix composites -- HIgh thermal conductivity metal matrix composites -- Thermally conductive ceramic matrix composites -- Thermal interface materials in electronic packaging -- Materials and design for advanced heat spreader and air cooling heat sinks -- Liquid cooling devices and their materials selection -- Thermoelectric cooling through thermoelectric materials -- Development and application of advanced thermal management materials -- Standards and specifications for evaluation of thermal management in electronic industry

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  • Status: Loanable