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Liu, Yong [Author]

Power electronic packaging : design, assembly process, reliability and modeling

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Media type: Book
Title: Power electronic packaging : design, assembly process, reliability and modeling
Contributor: Liu, Yong [Author]
imprint: New York; Heidelberg [u.a.]: Springer, 2012
Published in: Electrical engineering
Extent: XVIII, 591 S.; Ill., graph. Darst; 24 cm
Language: English
DOI: 10.1007/978-1-4614-1053-9
ISBN: 1461410525; 9781461410522
Identifier:

RVK notation: ZN 4192 : Technologie diskreter Bauelemente (Bonden; Gehäuse); Packaging
ZN 8340 : Leistungselektronik
Keywords: Elektronisches Bauelement > Bestücken
Elektronisches Bauelement > Durchschlagfestigkeit
Elektrisches Bauelement > Design
Elektrisches Bauelement > Thermodynamische Eigenschaft
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Footnote: Literaturangaben

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Departmental Library DrePunct – open access area

Shelf-mark: ZN 8340 L783
Item ID: 33725770

Status: Loanable

Bestand der TU Dresden

Shelf-mark: 2012 8 031657
Item ID: 11693762N

Status: Verfügbarkeit bitte in Prof Verfahrenstechnologie Elektronik erfragen.

Bestand der TU Dresden

Shelf-mark: 2014 8 022051
Item ID: 11830285N

Status: Verfügbarkeit bitte in Prof Leistungselektronik erfragen.