• Media type: E-Book
  • Title: Routing in the third dimension : from VLSI chips to MCMs
  • Contains: Preface. Acknowledgments. Introduction. Graphs and Basic Algorithms. Channel Routing and Terminal Assignment. Routing Models. Basic Problems in Routing. Routing Algorithms for the Two-Layer Process. Routing Algorithms for the Three-Layer Process. Routing Algorithms for the Advanced Three-Layered Process. Routing Algorithms for Advanced VLSI and Thin-Film MCMs. Routing Algorithms for General MCMs. Bibliography. Author Index. Subject Index
  • Contributor: Sherwani, N. A. [Other]; Bhingarde, Siddharth [Other]; Panyam, Anand [Other]
  • Corporation: IEEE Xplore (Online service) ; John Wiley & Sons
  • imprint: Piscataway, NJ; New York: IEEE Press, [1995]
    Online-Ausg.
  • Published in: IEEE Xplore Digital Library
  • Extent: Online Ressource (xviii, 358 p.); ill
  • Language: English
  • DOI: 10.1109/9780470546376
  • ISBN: 9780470546376; 0470546379
  • Identifier:
  • Keywords: Integrated circuits Very large scale integration Computer-aided design ; Multichip modules (Microelectronics) Computer-aided design ; Boîtier multipuce (Microélectronique) ; Conception assistée par ordinateur ; Circuit intégré à très grande échelle ; Electronic books
  • Type of reproduction: Online-Ausg.
  • Origination:
  • Footnote: Includes bibliographical references (p. 335-350) and indexes. - Description based on print version record
    Restricted to subscribers or individual electronic text purchasers
  • Description: This key text addresses the complex computer chips of tomorrow which will consist of several layers of metal interconnect, making the interconnect within a chip or a multichip module a three dimensional problem. You'll find an insightful approach to the algorithmic, cell design issues in chip and MCM routing with an emphasis on techniques for eliminating routing area