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Media type:
E-Article;
Text
Title:
An X-ray Microscopy Study of the Microstructural Effects on Thermal Conductivity in Cast Aluminum-Copper Compounds
Contributor:
Fromm, Andreas Christopher
[Author];
Kahra, Christoph
[Author];
Selmanovic, Armin
[Author];
Maier, Hans Jürgen
[Author];
Klose, Christian
[Author]
imprint:
Basel : MDPI, 2023
Published in:Metals : open access journal 13 (2023), Nr. 4 ; Metals : open access journal
Footnote:
Diese Datenquelle enthält auch Bestandsnachweise, die nicht zu einem Volltext führen.
Description:
A metallurgical joint between aluminum and copper established by compound casting provides for high thermal conductivity, which is required for lightweight cooling solutions in applications such as high-power light-emitting diodes or computer processors. If casting is employed in a silane-doped inert gas atmosphere whose oxygen partial pressure is adequate to extreme high vacuum, reoxidation of the active surfaces of aluminum and copper is prevented, and thus a metallurgical bond can be created directly between aluminum and copper. With this approach, thermal conductivities as high as 88.3 W/m·K were realized. In addition, X-ray microscopy was used to shed light on the microstructure–thermal property relationship. It is demonstrated that both porosity and non-bonded areas have a substantial impact on the thermophysical properties of the compound zone. Based on the data obtained, casting parameters can be developed that provide for defect-free bonding zones and optimal heat transfer between the joining partners.