Media type: E-Book; Thesis Title: Thermo-mechanical reliability of flip-chip assemblies with heat spreaders Contributor: Wunderle, Bernhard [Author] Language: English Identifier: Keywords: Flip-Chip-Technologie > Lötverbindung > Temperaturwechselbeständigkeit > Mechanische Beanspruchung > Lebensdauer > Finite-Elemente-Methode Origination: University thesis: Berlin, Techn. Univ., Diss., 2003 Footnote: Access State: Open Access