Media type: E-Article Title: Co‐design of micro‐fluidic heat sink and thermal through‐silicon‐vias for cooling of three‐dimensional integrated circuit Contributor: Shi, Bing; Srivastava, Ankur; Bar‐Cohen, Avram imprint: Institution of Engineering and Technology (IET), 2013 Published in: IET Circuits, Devices & Systems Language: English DOI: 10.1049/iet-cds.2013.0026 ISSN: 1751-858X; 1751-8598 Origination: Footnote: Access State: Open Access