• Media type: E-Article
  • Title: Influence of Si substrate orientation on stress development in Pd silicide films grown by solid-state reaction
  • Contributor: Gergaud, P.; Megdiche, M.; Thomas, O.; Chenevier, B.
  • imprint: AIP Publishing, 2003
  • Published in: Applied Physics Letters
  • Language: English
  • DOI: 10.1063/1.1601301
  • ISSN: 0003-6951; 1077-3118
  • Keywords: Physics and Astronomy (miscellaneous)
  • Origination:
  • Footnote:
  • Description: <jats:p>In situ real-time measurements of stress are performed during solid-state reaction of a palladium thin film with Si(001) or Si(111) single crystals. The stress in Pd2Si is compressive in both cases at variance with the sign of epitaxial misfit. A large difference in stress relaxation kinetics between fiber textured [on Si(001)] and epitaxial [on Si(111)] Pd2Si films is evidenced. This difference is correlated with a considerable variation in stress buildup during silicide growth. The microstructure of the growing phase is thus a key parameter for stress development during solid-state reaction.</jats:p>