Media type: Electronic Conference Proceeding Title: 3D TCAD Modeling For Stress Management In Through Silicon Via (TSV) Stacks Contributor: Xu, Xiaopeng; Karmarkar, Aditya Published: AIP, 2011 Published in: AIP Conference Proceedings (2011) Extent: Language: Not determined DOI: 10.1063/1.3615695 ISSN: 0094-243X Origination: Footnote: