Media type: Electronic Conference Proceeding Title: TCAD modeling of stress impact on performance and reliability in 3D IC structures Contributor: Xu, Xiaopeng; Karmarkar, Aditya Published: AIP Publishing LLC, 2014 Published in: AIP Conference Proceedings (2014) Extent: Language: Not determined DOI: 10.1063/1.4881346 ISSN: 0094-243X Origination: Footnote: