Media type: E-Article Title: Thermal Design of Immersion Cooling Modules for Electronic Components Contributor: BAR-COHEN, AVRAM imprint: Informa UK Limited, 1983 Published in: Heat Transfer Engineering Language: English DOI: 10.1080/01457638108939607 ISSN: 1521-0537; 0145-7632 Keywords: Fluid Flow and Transfer Processes ; Mechanical Engineering ; Condensed Matter Physics Origination: Footnote: