Media type: E-Article Title: A New Test Device for Characterization of Mechanical Stress Caused by Packaging Processes Contributor: Hirsch, Soeren; Doerner, Steffen; Hauptmann, Peter; Schmidt, Bertram imprint: IOP Publishing, 2006 Published in: Journal of Physics: Conference Series Language: Not determined DOI: 10.1088/1742-6596/34/1/007 ISSN: 1742-6596; 1742-6588 Keywords: General Physics and Astronomy Origination: Footnote: Access State: Open Access