Media type: E-Article Title: Plasma Etching of Tapered Features in Silicon for MEMS and Wafer Level Packaging Applications Contributor: Ngo, Ha-Duong; Hiess, Andre; Seidemann, Volker; Studzinski, Daniel; Lange, Martin; Leib, Jürgen; Shariff, Dzafir; Ashraf, Huma; Steel, Mike; Atabo, Lilian; Reast, Jon imprint: IOP Publishing, 2006 Published in: Journal of Physics: Conference Series Language: Not determined DOI: 10.1088/1742-6596/34/1/045 ISSN: 1742-6588; 1742-6596 Keywords: General Physics and Astronomy Origination: Footnote: Access State: Open Access