Description:
<jats:title>Abstract</jats:title>
<jats:p>This project reports on improving the thermal performance of light-emitting diode (LED) packages based on an optimized thermal structure with a sprayed cuprous oxide coating. Eighteen orthogonal arrays of LED aluminum plates were used and the influence of the parameters of thermal dissipation structure on the LED junction temperature was established. The junction temperature of the LED assembly is developed by various heat dissipation structures based on Taguchi methods. The experimental results show that by measuring the temperature of the 12W LED module, the best results were compared with the lowest values in the overall experiment, where the junction temperature dropped from 67°C to 51°C Also, the contribution of the error to the total variance is about 0.8%, indicating that the experiment is quite successful and robust results. It was found that lower junction temperature values were obtained with optimized heat sink structures with Cu2O-coated Al substrates, and the thermal performance of the LEDs was further improved.</jats:p>