Media type: E-Article Title: Stress measurement by copper electroplating based on grain growth Contributor: Kato, Akira Published: Springer Science and Business Media LLC, 1995 Published in: Experimental Mechanics, 35 (1995) 1, Seite 24-30 Language: English DOI: 10.1007/bf02325830 ISSN: 0014-4851; 1741-2765 Keywords: Mechanical Engineering ; Mechanics of Materials ; Aerospace Engineering Origination: Footnote: