Media type: E-Article Title: Material removal rate of double-faced mechanical polishing of 4H-SiC substrate Contributor: Zhang, Peng; Yang, Jingfang; Qiu, Huadong Published: Springer Science and Business Media LLC, 2022 Published in: The International Journal of Advanced Manufacturing Technology, 118 (2022) 11-12, Seite 3983-3993 Language: English DOI: 10.1007/s00170-021-08186-w ISSN: 1433-3015; 0268-3768 Origination: Footnote: