Media type: E-Article Title: Influence of Ni and Cu electrodeposits on the interfacial reaction between SAC305 solder and the Bi2(Te,Se)3 thermoelectric material Contributor: Cheng, Jinxuan; Hu, Xiaowu; Li, Qinglin imprint: Springer Science and Business Media LLC, 2019 Published in: Journal of Materials Science: Materials in Electronics Language: English DOI: 10.1007/s10854-019-01852-6 ISSN: 0957-4522; 1573-482X Keywords: Electrical and Electronic Engineering ; Condensed Matter Physics ; Atomic and Molecular Physics, and Optics ; Electronic, Optical and Magnetic Materials Origination: Footnote: