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Media type:
E-Article
Title:
Germanium-on-insulator substrates by wafer bonding
Contributor:
Tracy, Clarence J.;
Fejes, Peter;
Theodore, N. David;
Maniar, Papu;
Johnson, Eric;
Lamm, Albert J.;
Paler, Anthony M.;
Malik, Igor J.;
Ong, Philip
imprint:
Springer Science and Business Media LLC, 2004