Media type: E-Article Title: Microstructure Evolution of Cu-Cored Sn Solder Joints Under High Temperature and High Current Density Contributor: Sa, Xianzhang; Wu, Ping Published: Springer Science and Business Media LLC, 2013 Published in: Journal of Electronic Materials, 42 (2013) 8, Seite 2641-2647 Language: English DOI: 10.1007/s11664-013-2603-2 ISSN: 0361-5235; 1543-186X Keywords: Materials Chemistry ; Electrical and Electronic Engineering ; Condensed Matter Physics ; Electronic, Optical and Magnetic Materials Origination: Footnote: