Media type: E-Article Title: Investigation of diode geometry and metal line pattern for robust ESD protection applications Contributor: Li, You; Liou, Juin J.; Vinson, Jim imprint: Elsevier BV, 2008 Published in: Microelectronics Reliability Language: English DOI: 10.1016/j.microrel.2008.04.019 ISSN: 0026-2714 Keywords: Electrical and Electronic Engineering ; Surfaces, Coatings and Films ; Safety, Risk, Reliability and Quality ; Condensed Matter Physics ; Atomic and Molecular Physics, and Optics ; Electronic, Optical and Magnetic Materials Origination: Footnote: