Media type: E-Article Title: Microstructures and mechanical properties of ENIG/Sn-3.5Ag/ENIG joints formed by ultrasonic-assisted solder bonding Contributor: Kim, Hyeon-Tae; Yoon, Jeong-Won Published: Elsevier BV, 2023 Published in: Journal of Materials Research and Technology, 24 (2023), Seite 4468-4483 Language: English DOI: 10.1016/j.jmrt.2023.04.097 ISSN: 2238-7854 Origination: Footnote: Access State: Open Access