Media type: E-Article Title: Reliability prediction for TFBGA assemblies Contributor: Radivojevic, Z.; Abdul-Quadir, Y.; Myllykoski, P.; Rantala, J. Published: Institute of Electrical and Electronics Engineers (IEEE), 2006 Published in: IEEE Transactions on Components and Packaging Technologies, 29 (2006) 2, Seite 379-384 Language: Not determined DOI: 10.1109/tcapt.2006.875889 ISSN: 1521-3331 Keywords: Electrical and Electronic Engineering ; Electronic, Optical and Magnetic Materials Origination: Footnote: