Media type: E-Article Title: Laser-Assisted Sintering of Silver Nanoparticle Paste for Bonding of Silicon to DBC for High-Temperature Electronics Packaging Contributor: Liu, G. D.; Wang, Changhai; Swingler, Jonathan imprint: Institute of Electrical and Electronics Engineers (IEEE), 2021 Published in: IEEE Transactions on Components, Packaging and Manufacturing Technology Language: Not determined DOI: 10.1109/tcpmt.2020.3046917 ISSN: 2156-3985; 2156-3950 Keywords: Electrical and Electronic Engineering ; Industrial and Manufacturing Engineering ; Electronic, Optical and Magnetic Materials Origination: Footnote: