Media type: E-Article Title: Thermal–Mechanical Coupling Analysis for Coupled Power- and Thermal-Cycling Reliability of Board-Level Electronic Packages Contributor: Yi-Shao Lai; Tong Hong Wang; Chang-Chi Lee Published: Institute of Electrical and Electronics Engineers (IEEE), 2008 Published in: IEEE Transactions on Device and Materials Reliability, 8 (2008) 1, Seite 122-128 Language: Not determined DOI: 10.1109/tdmr.2007.915045 ISSN: 1530-4388; 1558-2574 Origination: Footnote: