De Messemaeker, Joke;
Roussel, Philippe J.;
Pedreira, Olalla Varela;
Van der Donck, Tom;
Van Huylenbroeck, Stefaan;
Beyne, Eric;
De Wolf, Ingrid;
Stucchi, Michele;
Croes, Kristof
Statistical Distribution of Through-Silicon via Cu Pumping
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Media type:
E-Article
Title:
Statistical Distribution of Through-Silicon via Cu Pumping
Contributor:
De Messemaeker, Joke;
Roussel, Philippe J.;
Pedreira, Olalla Varela;
Van der Donck, Tom;
Van Huylenbroeck, Stefaan;
Beyne, Eric;
De Wolf, Ingrid;
Stucchi, Michele;
Croes, Kristof
imprint:
Institute of Electrical and Electronics Engineers (IEEE), 2017
Published in:IEEE Transactions on Device and Materials Reliability