• Media type: E-Article
  • Title: Design Issues and Considerations for Low-Cost 3-D TSV IC Technology
  • Contributor: Van der Plas, Geert; Limaye, Paresh; Loi, Igor; Mercha, Abdelkarim; Oprins, Herman; Torregiani, Cristina; Thijs, Steven; Linten, Dimitri; Stucchi, Michele; Katti, Guruprasad; Velenis, Dimitrios; Cherman, Vladimir; Vandevelde, Bart; Simons, Veerle; De Wolf, Ingrid; Labie, Riet; Perry, Dan; Bronckers, Stephane; Minas, Nikolaos; Cupac, Miro; Ruythooren, Wouter; Van Olmen, Jan; Phommahaxay, Alain; de Potter de ten Broeck, Muriel; [...]
  • imprint: Institute of Electrical and Electronics Engineers (IEEE), 2011
  • Published in: IEEE Journal of Solid-State Circuits
  • Language: Not determined
  • DOI: 10.1109/jssc.2010.2074070
  • ISSN: 0018-9200; 1558-173X
  • Keywords: Electrical and Electronic Engineering
  • Origination:
  • Footnote: