Media type: E-Article Title: Dark Lock-in Thermography Identifies Solder Bond Failure as the Root Cause of Series Resistance Increase in Fielded Solar Modules Contributor: Asadpour, Reza; Sulas-Kern, Dana B.; Johnston, Steve; Meydbray, Jenya; Alam, Muhammad A. Published: Institute of Electrical and Electronics Engineers (IEEE), 2020 Published in: IEEE Journal of Photovoltaics, 10 (2020) 5, Seite 1409-1416 Language: Not determined DOI: 10.1109/jphotov.2020.3003781 ISSN: 2156-3381; 2156-3403 Origination: Footnote: