Media type: Electronic Conference Proceeding Title: Control of stress-void formation in aluminum-copper filled vias Contributor: Freeman, John L.; Grivna, Gordon; Tracy, Clarence J. imprint: SPIE, 1993 Published in: SPIE Proceedings Extent: Language: Not determined DOI: 10.1117/12.145477 ISSN: 0277-786X Origination: Footnote: