Media type: Electronic Conference Proceeding Title: Elimination of stress-induced voids on AlCu multilevel interconnect lines Contributor: Grivna, Gordon; Freeman, John L.; Tracy, Clarence J. imprint: SPIE, 1993 Published in: SPIE Proceedings Extent: Language: Not determined DOI: 10.1117/12.156518 ISSN: 0277-786X Origination: Footnote: