Effect of Diffusion Annealing Temperature on Crack-initiating Omnipresent Flaws, Void/crack Propagation and Dislocation Movements Along Ni Surface-layered Bi-2223 Crystal Structure
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Media type:
E-Article
Title:
Effect of Diffusion Annealing Temperature on Crack-initiating Omnipresent Flaws, Void/crack Propagation and Dislocation Movements Along Ni Surface-layered Bi-2223 Crystal Structure
Contributor:
Turgay, Tahsin;
Yıldırım, Gürcan
Published:
Sakarya University Journal of Science, 2018
Published in:
Sakarya University Journal of Science (2018), Seite 1-1