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Media type:
E-Article
Title:
Recent Advances in Thermal Interface Materials for Thermal Management of High-Power Electronics
Contributor:
Xing, Wenkui;
Xu, Yue;
Song, Chengyi;
Deng, Tao
imprint:
MDPI AG, 2022
Published in:Nanomaterials
Language:
English
DOI:
10.3390/nano12193365
ISSN:
2079-4991
Origination:
Footnote:
Description:
<jats:p>With the increased level of integration and miniaturization of modern electronics, high-power density electronics require efficient heat dissipation per unit area. To improve the heat dissipation capability of high-power electronic systems, advanced thermal interface materials (TIMs) with high thermal conductivity and low interfacial thermal resistance are urgently needed in the structural design of advanced electronics. Metal-, carbon- and polymer-based TIMs can reach high thermal conductivity and are promising for heat dissipation in high-power electronics. This review article introduces the heat dissipation models, classification, performances and fabrication methods of advanced TIMs, and provides a summary of the recent research status and developing trends of micro- and nanoscale TIMs used for heat dissipation in high-power electronics.</jats:p>