Media type: E-Article Title: Microwave and Millimeter-Wave Evaluation of Copper-Clad Dielectric Substrates Contributor: Kobayashi, Yoshio imprint: Japan Institute of Electronics Packaging, 2015 Published in: Journal of Japan Institute of Electronics Packaging Language: English DOI: 10.5104/jiep.18.311 ISSN: 1343-9677; 1884-121X Keywords: Electrical and Electronic Engineering Origination: Footnote: Access State: Open Access