Media type: E-Article Title: Effect of test structure on electromigration characteristics in three-dimensional through silicon via stacked devices Contributor: Oba, Yoshiyuki; De Messemaeker, Joke; Tyrovouzi, Anna Maria; Miyamori, Yuichi; De Vos, Joeri; Wang, Teng; Beyer, Gerald; Beyne, Eric; De Wolf, Ingrid; Croes, Kristof imprint: IOP Publishing, 2015 Published in: Japanese Journal of Applied Physics Language: Not determined DOI: 10.7567/jjap.54.05ee01 ISSN: 0021-4922; 1347-4065 Keywords: General Physics and Astronomy ; Physics and Astronomy (miscellaneous) ; General Engineering Origination: Footnote: