Sie können Bookmarks mittels Listen verwalten, loggen Sie sich dafür bitte in Ihr SLUB Benutzerkonto ein.
Medientyp:
Buch
Titel:
Lead-free electronic solders
:
a special issue of the Journal of Materials Science: materials in electronics
Enthält:
Thermodynamics and phase diagrams of lead-free solder materials
/ H. Ipser, et. al.
Thermodynamics and phase diagrams of lead-free solder materials /H. Ipser, et. al. --Phase diagrams of Pb-free solders and their related materials systems /Sinn-Wen Chen, et. al. --Effects of suppressed beta tin nucleation on the microstructural evolution of lead-free solder joints /D. Swenson -- Development of Sn-Ag-Cu and Sn-Ag-Cu-X alloys for Pb-free electronic solder applications /Iver E. Anderson --Rare earth additions to lead-free electronic solders /C. M. L. Wu, et. al. --Compression stress-strain and creep properties of the 52ln-48Sn and 97lm-3Ag low-temperature Pb-free solders /Paul T. Vianco, et. al. --Sn-Zn low temperature solder /Katsuki Suganuma, et. al. --Composite lead-free electronic solders /Fu Guo --Processing and material issues related to lead-free soldering /Laura J. Turbini --Interfacial reaction issues for lead-free electronic solders /C. E. Ho, et. al. --Microstructure-based modeling of deformation in Sn-rich (Pb-free) solder alloys /N. Chawla, et. al. --Deformation behavior of tin and some tin alloys /Fuqian Yang, et al. --Mechanical fatigue of Sn-rich Pb-free solder alloys /J. K. Shang, et. al. --Life expectancies of Pb-free SAC solder interconnects in electronic hardware /Michael Osterman, et. al. --Assessment of factors influencing thermomechanical fatigue behavior of Sn-based solder joints under severe service environments /K. N. Subramanian --Electromigration statistics and damage evolution for Pb-free solder joints with Cu and Ni UBM in plastic flip-chip packages /Seung-Hyun Chae, et. al. --Electromigration issues in lead-free solder joints /Chih Chen, et. al. --Stress analysis of spontaneous Sn whisker growth /K. N. Tu, et. al. --Sn-whiskers: truths and myths /J. W. Osenbach, et. al. --Tin pest issues in lead-free electronic solders /W. J. Plumbridge --Issues related to the implementation of Pb-free electronic solders in consumer electronics /D. R. Frear --Impact of the ROHS Directive on high-performance electronic systems Part I: need for lead utilization in exempt systems /Karl J. Puttlitz, et. al. --Impact of the ROHS Directive on high-performance electronic systems Part II: key reliability issues preventing the implementation of lead-free solders /Karl J. Puttlitz, et. al.
Phase diagrams of Pb-free solders and their related materials systems
/ Sinn-Wen Chen, et. al.
Effects of suppressed beta tin nucleation on the microstructural evolution of lead-free solder joints
/ D. Swenson -- Development of Sn-Ag-Cu and Sn-Ag-Cu-X alloys for Pb-free electronic solder applications
Rare earth additions to lead-free electronic solders
/ C. M. L. Wu, et. al.
Compression stress-strain and creep properties of the 52ln-48Sn and 97lm-3Ag low-temperature Pb-free solders
/ Paul T. Vianco, et. al.
Sn-Zn low temperature solder
/ Katsuki Suganuma, et. al.
Composite lead-free electronic solders
/ Fu Guo
Processing and material issues related to lead-free soldering
/ Laura J. Turbini
Interfacial reaction issues for lead-free electronic solders
/ C. E. Ho, et. al.
Microstructure-based modeling of deformation in Sn-rich (Pb-free) solder alloys
/ N. Chawla, et. al.
Deformation behavior of tin and some tin alloys
/ Fuqian Yang, et al.
Mechanical fatigue of Sn-rich Pb-free solder alloys
/ J. K. Shang, et. al.
Life expectancies of Pb-free SAC solder interconnects in electronic hardware
/ Michael Osterman, et. al.
Assessment of factors influencing thermomechanical fatigue behavior of Sn-based solder joints under severe service environments
/ K. N. Subramanian
Electromigration statistics and damage evolution for Pb-free solder joints with Cu and Ni UBM in plastic flip-chip packages
/ Seung-Hyun Chae, et. al.
Electromigration issues in lead-free solder joints
/ Chih Chen, et. al.
Stress analysis of spontaneous Sn whisker growth
/ K. N. Tu, et. al.
Sn-whiskers: truths and myths
/ J. W. Osenbach, et. al.
Tin pest issues in lead-free electronic solders
/ W. J. Plumbridge
Issues related to the implementation of Pb-free electronic solders in consumer electronics
/ D. R. Frear
Impact of the ROHS Directive on high-performance electronic systems Part I: need for lead utilization in exempt systems
/ Karl J. Puttlitz, et. al.
Impact of the ROHS Directive on high-performance electronic systems Part II: key reliability issues preventing the implementation of lead-free solders
/ Karl J. Puttlitz, et. al.