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Zou, Liqing [VerfasserIn]; Su, Hua [VerfasserIn]; Zhang, Jianyang [VerfasserIn]; Yin, Tao [VerfasserIn]; Lin, Pengcheng [VerfasserIn]; Zhao, Xi [VerfasserIn]; Liu, Xingru [VerfasserIn]; Yu, Weitai [VerfasserIn]; Sheng, Xinxin [VerfasserIn]; Chen, Ying [VerfasserIn]

Highly-Efficient Thermal Management of Electronic Devices Enabled by Boron Nitride Incorporated Phase Change Material Gels with Superior Form-Stability, Enhanced Thermal Conductivity and High Thermal Energy Storage Capacity

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  • Medientyp: E-Book
  • Titel: Highly-Efficient Thermal Management of Electronic Devices Enabled by Boron Nitride Incorporated Phase Change Material Gels with Superior Form-Stability, Enhanced Thermal Conductivity and High Thermal Energy Storage Capacity
  • Beteiligte: Zou, Liqing [VerfasserIn]; Su, Hua [VerfasserIn]; Zhang, Jianyang [VerfasserIn]; Yin, Tao [VerfasserIn]; Lin, Pengcheng [VerfasserIn]; Zhao, Xi [VerfasserIn]; Liu, Xingru [VerfasserIn]; Yu, Weitai [VerfasserIn]; Sheng, Xinxin [VerfasserIn]; Chen, Ying [VerfasserIn]
  • Erschienen: [S.l.]: SSRN, [2022]
  • Umfang: 1 Online-Ressource (29 p)
  • Sprache: Englisch
  • DOI: 10.2139/ssrn.4011024
  • Identifikator:
  • Entstehung:
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  • Beschreibung: The problem of heat dissipation has become the key to restrict the operation state and service time of electronic components. In this work, ternary eicosanestyrene-ethylene-butylene-styrene (SEBS)@boron nitride gels (ESBGs) are fabricated by liquid phase blending and sol-gel transition towards the highly-efficient thermal management of electronic devices. Eicosane possessing high thermal energy storage capacity are chemically stable and bio-safe. SEBS can be miscible with eicosane to confine the mobility of liquid eicosane and provide the free-standing feature. The boron nitride (BN) micro-flakes that homogeneously dispersed in eicosane can enhance the heat conduction. Specifically, the Van der Waals force between SEBS and eicosane and the π-π interaction between SEBS and BN enable the excellent form-stability of the ESBGs. Taking advantages of the merits of the functional components, the proposed ESBGs demonstrate high thermal energy storage capacity of 157.5 Jg -1 and high thermal conductivity of 1.08 Wm -1 K -1 . The ESBGs are applied in the thermal management of CPU and chip to reduce their working temperature via the synergistic effect of heat dissipation and heat storage. It is anticipated that the ESBGs create a state-of-the-art alternative for the next-generation flexible and multifunctional thermal management devices
  • Zugangsstatus: Freier Zugang