Guo, Ying
[Verfasser:in];
Wen-quan, Li
[Verfasser:in];
Xin-gang, Liu
[Verfasser:in];
Sugio, Kenjiro
[Verfasser:in];
Yu-jiao, Ke
[Verfasser:in];
Kai-yao, Wang
[Verfasser:in];
Wen-chuang, Liu
[Verfasser:in];
Sasaki, Gen
[Verfasser:in]
Effect of Copper Coating on Interfacial Properties, Interfacial Thermal Resistance, Microstructure Evolution and Mechanical Properties of Aluminum Matrix Composites
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Titel:
Effect of Copper Coating on Interfacial Properties, Interfacial Thermal Resistance, Microstructure Evolution and Mechanical Properties of Aluminum Matrix Composites
Beschreibung:
In this study, uncoated and copper-coated short carbon fiber reinforced aluminum matrix composites were prepared by spark plasma sintering. The arrangement of short carbon fiber was changed by hot rolling. Then investigating the effect of copper coating on microstructure evolution and properties. The results show that the copper coating can inhibit the formation of harmful product Al4C3 at the interface and protect the structure of short carbon fibers from being damaged during hot rolling. Thus, the hot-rolled copper coated composites have higher yield strength and better thermal conductivity. The interfacial product and its thickness have a specific effect on the interfacial thermal resistance. For the interfacial product with low thermal conductivity, the thickness of the product is proportional to the interfacial thermal resistance. The dynamic recrystallization mechanisms of uncoated and copper-coated composites included the continuous dynamic recrystallization mechanism, grain nucleation mechanism of shear band, and rotated-Gauss component promoting nucleation mechanism. The copper coating enhanced the interfacial coherence and promoted the nucleation and growth of P-oriented grains and rotated-Gauss-oriented grains by promoting the movement of shear bands